congatec’s brand new boards and modules with the latest low-power processors from Intel® offer embedded applications 30% more processing power and 45% more graphics performance in 100% industrial-grade and long-term available congatec quality. That is the major message of congatec’s brand new line-up. Designers across the broad spectrum of embedded markets from automation to retail will find essential value in the improved performance-per-watt at a power envelope of only 6‑12 watt. Additionally, new graphics capabilities for up to three independent 4k high-resolution displays are fueled by the powerful Intel® Gen 9 graphics engine, which was previously only available at the high-end level of Intel® Core™ processors. Furthermore, all form factors support real-time applications based on the hardware integrated IEEE 1588 compliant Precision Time Protocol that can deliver nanosecond synchronization accuracy for time critical industry 4.0 applications. Extended temperature support, accommodating ambient temperatures ranging from -40°C to +85°C, and long term availability of up to ten years round out the benefits of the new congatec offerings.
Mini-ITX and Pico-ITX
For any slim line standard system design that doesn’t require a dedicated PCB for a customized feature set, the new conga-IA5 Thin Mini-ITX motherboards and conga-PA5 Pico-ITX single board computers (SBCs) offer engineers a range of attractive options. These boards are application-ready for immediate use and provide a long term availability of up to ten years. Backed up by congatec’s personal integration services with advanced BSP or driver support they simplify the integration into any application. IoT engineers can also capitalize on the support of SIM cards offered by congatec’s industrial Thin Mini-ITX motherboard, greatly reducing the complexity of remote connections to the board via cellular infrastructures. The Pico-ITX SBC offers excellent flexibility with a wide range of interfaces in a very small footprint.
COM Express, Qseven and SMARC 2.0 modules
For applications that require highly customizable interfaces via a dedicated carrier board, engineers have the choice of four different COM Express, Qseven and – this is really new – SMARC 2.0 Computer-on-Modules. Optionally, congatec also provides dedicated carrier board designs for these modules. congatec is open to any type of design cooperation, and engineers are completely free to decide whether carrier board design is the OEM’s core competence or whether resources are better used by outsourcing.
To help determine which Computer-on-Module form factor is the right one for the individual design, congatec offers guidance at a glance: The COM Express Compact modules are for designs that require not only low power but also a more powerful Intel® Core™ processor. To choose between SMARC 2.0 and Qseven, designers need only decide whether the system is more deeply embedded (ideal for Qseven) or more graphics- and feature-rich (optimal for SMARC 2.0.).
WiFi, Bluetooth LE and NFC on module
It is of interest to note here that the credit card sized SMARC 2.0 offers wireless interfaces as an option, adding tangible design value. The first congatec module based on the new Intel® Pentium® processor includes optional WiFi, Bluetooth Low Energy and NFC connectivity directly implemented on the module. This enables designers to more easily develop applications where distributed wireless sensors, actors and other devices need a local IoT gateway.
To learn more about congatec’s brand new line-up, please click here: http://www.congatec.com/technologies/Apollo-Lake-f...
