Peak performance on demand
This whitepaper from congatec looks at the the third generation of Intel Core processors, which not only shrink the manufacturing process from 32 to 22nm, but also use a new technology with 3d tri gate transistors.
This allows for smaller die sizes reducing the cost of manufacturing and increasing power efficiency by up to 25%. The new integrated Intel HD4000 graphics, which features 16 instead of 12 parallel processing cores, offers about 40% more processing power and supports up to three independent high definition displays.
