Engineering publications brought to you by Mark Allen

NXP announces S32N55 ‘super-integration’ processor

Variscite and SecEdge to offer customers Out-of-the-Box secure connectivity

Silicon Labs unveils new family of wireless SoCs and MCUs

Renesas announces new features for its Quick Connect Studio

Farnell brings Silex Wi-Fi 6 Radio Development Kit to industrial developers

CSA Catapult opens new DER-funded advanced packaging facility

Innovative Memory in Pixel (MIP) display technology offers ultra-low power consumption and excellent image quality

Toshiba releases power MOSFETs to improve efficiency of power supplies

Alif Semiconductor unveils Balletto family of MCUs for AI/ML workloads

Synaptics launches Astra AI-native IoT Platform

Carrar raises funds to deliver commercial battery modules for electric vehicles

Bulgin introduces expanded beam fibre optic connector technology