Engineering publications brought to you by Mark Allen

Leti demonstrates 300mm wafer-to-wafer direct hybrid bonding with pitch dimension of just 1µm

Molecular magnetism packs power with 'messenger electron'

Project aims to restore vision through cortical stimulation

Beryllium doped GaN could be ‘next generation of power electronics’

IBM develops prototype 50 qubit processor

Pico-EZmate slim 1.2mm pitch wire-to-board connection system

16bit MCU range expanded

Three-phase half-bridge gate driver simplifies BLDC and PMSM motor drive

Loopback cards for transceiver test

Transfer technique produces low cost GaN sensors for range of applications

IDE for Renesas RX MCUs gets safety update

Blu Wireless joins 60GHz working group