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Packing a punch
Neil Tyler
Interviews
28 Apr 2023
Infineon introduces the HybridPACK Drive G2 power module
Product Launches
28 Apr 2023
Germany may restrict export of chip chemicals to China
Neil Tyler
News
28 Apr 2023
Top 10 IC design houses see revenues drop almost 10 per cent in Q4 2022
Neil Tyler
News
28 Apr 2023
Transphorm introduces new SuperGaN FETs in Standard PQFN packages
Neil Tyler
News
28 Apr 2023
Lattice extends low power FPGA portfolio with the MachXO5T-NX family
Neil Tyler
News
28 Apr 2023
Microsoft/Activision Blizzard deal blocked
Neil Tyler
Blogs
27 Apr 2023
Sony performance-enhanced camera block now commercially available
Neil Tyler
Product Launches
27 Apr 2023
300W buck-boost non-isolated DC-DC converters have wide range input and outputs
Neil Tyler
Product Launches
27 Apr 2023
Synopsys, TSMC and Ansys to collaborate on advanced multi-die systems
Neil Tyler
News
27 Apr 2023
Q5d unveils robot for automating wiring harness manufacturing
Neil Tyler
News
27 Apr 2023
TTTech Auto launches ECU to future-proof automotive E/E architectures
Neil Tyler
News
27 Apr 2023
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