Engineering publications brought to you by Mark Allen

SiFive collaborates with Imperas, qualifies models

First 8 megapixel medical-grade image sensors for endoscopes

TI humidity sensors

X-FAB unveils AMS Design Kit for Siemens’ Tanner IC Design Tools

Hard core: the challenges of programming multicore architecture

Infrared-based dynamic gesture sensor

Farnell looks to bring the 'feel good' factor to customers

Report identifies EV and autonomous vehicle software challenges

UL offers first Wi-Fi 6E testing services in Europe

Sunderland 'gigafactory'?

Nvidia Aerial 5G Platform extends support for Arm

Quantum-tunnelling semiconductor IP verified as secure