Engineering publications brought to you by Mark Allen

Audio

T2M unveils ultra low-power Bluetooth dual mode RF IP

Growing hygiene concerns

DSP Group acquires SoundChip

Infineon develops self-contained Raspberry Pi audio HAT board

Addressing hearing loss

High power speaker amp ICs for advanced instrument clusters

TT Electronics expands variable resistor portfolio

Diodes extends DisplayPort portfolio

CEVA's DSP and Voice Neural Networks integrated with TensorFlow Lite

Billions of Bluetooth devices to serve diiverse range of industries by 2024

Cadence Tensilica HiFi IP accelerates AI deployment

NXP to leverage Fraunhofer’s MPEG audio SDK