Engineering publications brought to you by Mark Allen

Automotive

Expanded dual- and single-core dsPIC DSC family from Microchip

System success

Step down voltage converter from TI

Automotive grade single-chip VGA ToF sensor from Melexis

Cadence Tensilica ConnX B20 DSP boosts performance

GaN platform from Transphorm earns automotive qualification

Zuken introduces new solution for 3D harness design optimisation

LDRA to Support MISRA C:2012 and new integrated MISRA/AUTOSAR C++ guidelines

Toshiba Memory Europe and OSR Enterprises extend collaboration

Integrated automotive ethernet solution

Grade 0 automotive-compliant omnipolar Hall-Effect switches

PCIe 3.1 Ethernet bridges target embedded and automotive platforms