Engineering publications brought to you by Mark Allen

Automotive

Automotive engineers outline their thermal challenges for 2020

Allegro MicroSystems acquires Voxtel

Broadcom overtakes Qualcomm in Q2 2020

Bringing smart interior lighting to automotive applications

Toshiba’s unveils distributed co-simulation platform

Ultraleap brings natural XR interactions to Snapdragon XR2 5G reference design

NXP unveils in-vehicle multi-device wireless charging solutions

New compound exhibits 'superb' magnetism

Automotive grade dual inductor reduces component count

Microchip unveils 4 Mbit EEPROM memory device

A supply chain in flux

Arrow introduces automotive high voltage evaluation platform