Engineering publications brought to you by Mark Allen

Board level design

STM32H5 Discovery kit accelerates building secure, smart, connected devices

X-FAB providing foundry service for passive device integration

Cadence unveils next-generation AI-driven OrCAD X

Certus and Pragma Design offer embedded ESD detection technology

APPLAUSE research project delivers advances in medical technology

First 4-inch aluminium nitride substrate

THERM-A-GAP GEL 50TBL, a dispensable thermal gel for thin bond line applications

Arduino Pro Portenta C33 SBC now available from Farnell

Infineon uses recyclable PCBs from Jiva Materials to reduce electronic waste

Qorvo announces release of QSPICE for power and analogue designers

Toshiba and MikroElektronika to accelerate automotive motor control development

TrendForce predicts PCB market contraction in 2023