Engineering publications brought to you by Mark Allen

Board level design

First 4-inch aluminium nitride substrate

THERM-A-GAP GEL 50TBL, a dispensable thermal gel for thin bond line applications

Arduino Pro Portenta C33 SBC now available from Farnell

Infineon uses recyclable PCBs from Jiva Materials to reduce electronic waste

Qorvo announces release of QSPICE for power and analogue designers

Toshiba and MikroElektronika to accelerate automotive motor control development

TrendForce predicts PCB market contraction in 2023

Farnell adds BeagleV-Ahead single board computer to its portfolio

Harwin offers downloadable CAD models

Parker offers new gap filler pad with high thermal conductivity

Hirose releases multi-RF board-to-board connector

Renesas selects Altium to unify company-wide PCB development