Engineering publications brought to you by Mark Allen

Consumer

MediaTek upgrades gaming experiences on 5G smartphones

Apple embraces self-repairability, up to a point!

POLYN Technology signs first customer for NASP Tiny AI chips

Quantum secure electronic passports under development

Luxshare-ICT selects USound as strategic MEMS loudspeaker supplier

Kyocera develops GaN laser chip for mass production

SECORA Pay Bio to bring biometric payment cards to a new level

Hahn-Schickard and Bosch Sensortec to develop acoustic microsystems

CEVA introduces Voice User Interface Solution for TI SimpleLink MCUs

Power semiconductor predictions for 2023

Infineon`s latest audio amplifiers feature MERUS technology

Micron unveils advanced mobile memory