Engineering publications brought to you by Mark Allen

Electronics

Renesas presents key technologies for automotive communication gateway SoCs

Research points to thinner and cheaper ‘next generation’ flat screens

‘An overabundance of gadgets and gizmos’

NXP looks to improve security and Matter device user experience

Paragraf manufacturing facility to massively boost production

Qualinx raises €8m to bring low-power digital RF technology to market

Teledyne e2v provides radiation-tolerant DDR4 memory solution

Amkor and GlobalFoundries establish new strategic partnership

Anglia achieves Carbon Neutral status for its business operation

Filtronic automates wedge bonding for complex wire components

Microchip to invest $880m to expand SiC and Si capacity

Winbond joins UCIe Consortium to support chiplet interface standardisation