Engineering publications brought to you by Mark Allen

Electronics

Renesas and Indian ITH sign research and collaboration MoU

Vanguard International and NXP to build and operate 300mm fab in Singapore

Siemens announces breakthroughs in high-level verification of C++

Apollo to acquire stake in Intel’s Fab 34 in Ireland

Rapidus and IBM extend chiplet packaging collaboration

TSMC considered moving fabs out of Taiwan

Codasip introduces latest RISC-V core for power-efficient applications

SureCore unveils low power cryogenic memory technology

Raspberry Pi selects Hailo to enable advanced AI capabilities for Raspberry Pi 5

NXP and ZF collaborate on SiC-based traction inverters to boost EV powertrains

Intelligent integrated sensor for presence detection, facial recognition and always-on

ASML and imec open joint HIgh NA EUV Lithography Lab