Engineering publications brought to you by Mark Allen

Electronics

Codasip partners with SmartDV to accelerate chip design projects

Farmers Market

Mouser adds Security, IoT, and Low Power Wireless to Dev Kit line-up

MediaTek dominates 4G smartphone chipset market

Dracula Technologies unveils next generation of LAYER OPV modules

Micron flash solution optimised for AI and 5G data-intensive flagship smartphones

AMD to expand adaptive computing research, development and engineering operations in Ireland

Airbus and ST collaborate on power electronics for aircraft electrification

CGD signs global distribution agreement with Digikey

NPL support aids BiologIC Technologies’ biocomputer technology

Septentrio and Point One Navigation expand precision location partnership to Europe

CEA-Leti and Intel to develop atomically thin 2D TMDs on 300mm wafers