Engineering publications brought to you by Mark Allen

Electronics

Nexeon awarded funding for silicon materials scale-up

StoreDot starts shipping EV battery cell samples for testing with automotive manufacturers

SK Hynix to invest $11bn in new memory chip plant

Meta and Qualcomm sign VR chip deal

ST introduces Stellar P6 automotive MCU for EV platform system integration

Energy harvesting multi-protocol wireless connectivity module

‘Game Changing’ robotic development kits

First ‘off-the-shelf’ A-PHY camera module

Renesas unveils Si IGBTs for Electric Vehicle inverters

Digi-Key stocking Blueshift RockeTape thermal insulation tapes

DESIGN TIPS from ADI: Overvoltage protection for sensitive electronic signal inputs

Codasip joins Intel Pathfinder for RISC-V programme