Engineering publications brought to you by Mark Allen

Integration

Imec first to stack FinFETS with 45nm fin pitch using sequential 3D integration

C&K's SAM series multiway switches

Silicon photonics to meet communication needs

Graphene photodetectors set speed record

Technology to integrate FPGA functionality into SoCs

Seamless design for smart models

Optimising wearable designs by integrating support circuitry

Latest Bluetooth SoC offers integration and flexibility

The choice between discrete and integrated solutions for sensor conditioning

IP lightens up

Thinking outside the box