Engineering publications brought to you by Mark Allen

Interconnect

TeraSignal introduces TSLink architecture

Industry’s first CMOS intelligent re-drivers set to transform AI and compute interconnects

Ayar Labs announces new funding to support optical I/O roadmap

Industry leaders join forces to standardise chiplet ecosystem

Harwin adds female contact to its Datamate Mix-Tek options

Rosenberger and ST develop high-speed contactless connector

Mouser stocking Samtec’s COM-HPC interconnect solutions

Ranovus announces second-generation “co-packaged optics” chip

Diodes expands video passive multiplexer/demultiplexer switch portfolio

Mellanox unveils SN4000 Ethernet switches for cloud applications

Prophesee joins IRT Nanoelec’s 3D Integration Program

Molex introduces Coeur CST high-current interconnect system