Engineering publications brought to you by Mark Allen

Matter

Ceva delivers greater connectivity with new multi-protocol wireless IP

Outlook 2024: Laying the foundations

CommScope and ST make Matter IoT device provisioning secure and easy

Embedded World: Combo wireless module combines Wi-Fi 6, Bluetooth and IEEE 802.15.4 LR-WPAN connectivity

NXP looks to improve security and Matter device user experience

Wi-Fi Development Kit with support for Matter protocol

NXP expands Matter portfolio with secure wireless MCUs

Matter at major ‘inflection point’

NXP’s Matter Development Platforms to accelerate use of new Matter Standard

Matter 1.0 standard and certification programme released

Nordic Semi announces first Wi-Fi chip

Silicon Labs looks to brings AI/ML to the Edge with Matter-ready platform