Engineering publications brought to you by Mark Allen

Packaging

US-JOINT consortium to develop advanced semiconductor packaging

Rapidus and IBM extend chiplet packaging collaboration

CSA Catapult opens new DER-funded advanced packaging facility

Nexperia offering GaN FETs in compact CCPAK SMD packaging

Second-hand device market to boom

Sondrel warns that packaging lead times have jumped to more than 50 weeks

PragmatIC leads project to digitise reusable packaging

A ‘New Era’ in space products

Worldwide SATS market revenue to grow

The design of an enclosure is usually left until the last minute - this has to change

Printed transistors from 2D nanomaterials

Tailor-made packaging of fibre-optic cables