Engineering publications brought to you by Mark Allen

Thermal management

Liquid cooling

Automotive engineers outline their thermal challenges for 2020

Anglia offers customised heatsink capability

CEA-Leti paves the way for high-performance 3D monolithic CMOS integration

Advanced thermal management IC test solutions

JEDEC-compliant temperature sensor for DDR5 modules

Improved 1350V IGBT for domestic appliance applications

Siemens releases latest Simcenter FLOEFD software

Putting the spotlight on LED thermal design

New generation of high-performance thermoelectric coolers

Fujitsu develops flexible nanotube adhesive sheet technology

Report outlines 2020 trends and thermal challenges in the LED industry