Engineering publications brought to you by Mark Allen

Wireless technology

UniBlock presents low-latency wireless chipset

L-com’s rubber duck antennas offer small size but a big reach

ST and Qualcomm announce strategic wireless/IoT collaboration

SIAE MICROELETTRONICA selects EnSilica to design ASICs for next-generation telecom equipment

Collaboration rolls out rail mmWave connectivity solution in the US

u-blox unveils X20 all-band high-precision GNSS platform

Kapsch TrafficCom presents first light-powered transponder

Qorvo introduces next-generation Matter solution

VIAVI tackles testing complexity with Automation and Orchestration Platform

NXP's Trimension SR250 targets autonomous industrial and IoT applications

How connected tools are redefining construction and assembly sites

Nordic Semi unveils latest solution for the IoT market