Engineering publications brought to you by Mark Allen

Green Mountain Semiconductor develops ‘innovative’ AI processor

Würth Elektronik launches HyPerStripes research project

TTI Europe shipping TE Connectivity’s high-voltage connectors for E-mobility applications

onsemi opens systems application lab for electric vehicles in Europe

Infineon extends CoolSiC portfolio with industry-standard package

QuickLogic unveils enhanced Aurora FPGA/eFPGA user tools

Cadence and Autodesk collaborate on smart product design

Secure-IC’s Securyzr technology integrated into MediaTek's Dimensity 9300

Evonik to build first plant in North America for ultra-pure colloidal silica

SIGLENT releases new flagship SDS7000A oscilloscope

Toshiba launches first 30V N-Channel Common-Drain MOSFET

Synopsys.ai Copilot to accelerate chip design