Engineering publications brought to you by Mark Allen

Winbond earns ISO/SAE 21434 certification for W77Q Secure Flash

Keysight supporting Stuttgart University’s advanced 6G integrated circuits research

THERM-A-GAP GEL 50TBL, a dispensable thermal gel for thin bond line applications

TSMC commits to German fab

Lightelligence introduces optical interconnects for composable data centre architectures

Allegro MicroSystems to acquire Crocus Technology

Cornish Lithium to open first lithium mine in Britain

Three things you need to know about Industry 5.0

Q-CTRL achieves ISO 27001 certification

Blueshift Memory announces successful development of computer vision AI accelerator chip

New remote electrical tilt antennas

CEVA unveils enhanced NeuPro-M NPU IP family