Engineering publications brought to you by Mark Allen

New SCALE-iFlex LT NTC IGBT/SiC Module gate drivers

Toshiba’s digital isolators deliver high-speed multi-channel operation

Microchip unveils silicon carbide E-Fuse demonstrator to protect EV power electronics

rFpro announces collaboration with Sony Semiconductor Solutions

Qualcomm set to acquire Autotalks

Infineon extends CoolSiC power module portfolio

Reference demo addresses 850 VDC applications with 650V GaN fulfilling EV and industrial requirements

ULEMCo to lead £8m Hydrogen Fuel Cell Project

Regulating artificial intelligence

NEO Semiconductor launches 3D X-DRAM technology

UMC unveils 40nm RFSOI platform to accelerate 5G mmWave applications

WiBotic introduces PowerPad Pro, enhancing UAV capabilities