Engineering publications brought to you by Mark Allen

JDIT-K enhances line-up of high resolution TFT display modules

ST and HighTec EDV-Systeme look to accelerate development of safer software-defined vehicles

Kyocera unveils first Camera-LIDAR fusion sensor with perfect optical alignment

DigiKey adds over a million new parts in 2024

The freedom to communicate

Cambridge Sensoriis unveils advanced capabilities for ARC System

OKI achieves 3D integration of thin-film analogue ICs

binder introduces connectors for rail and transport applications

Keysight and University of Malaga unveil 6G Research and Innovation Laboratory

Hitek Systems launches eSOM7 development platform for FPGA wireless solutions

EnSilica awarded £10m for satellite broadband terminal chips

Silicon Labs targets ultra-low power Bluetooth connectivity with latest SoCs