Engineering publications brought to you by Mark Allen

ST and Soitec cooperate on SiC substrate manufacturing technology

USC’s MOSIS and SkyWater deliver silicon IC design and manufacturing service

Global Women in Engineering 2022 Survey

Avnet Abacus looks to save millions of smart meters from landfill

congatec unveils standard-compliant Computer-on-Modules

ROHM develops ultra-low-power on-device learning Edge AI chip

ST reveals 100W wireless power receiver for fastest Qi-compliant charging

Imperas and Andes collaborate to support RISC-V innovations

POLYN Technology signs first customer for NASP Tiny AI chips

Semtech and AWS collaborate on IoT Track and Trace Services

Up-front processing

Worldwide semiconductor revenue growth to decline in 2023