Engineering publications brought to you by Mark Allen

Luxshare-ICT selects USound as strategic MEMS loudspeaker supplier

EU moves step closer to fund chip production

EasyPACK 4B enables single module solution for 352 kW photovoltaic string inverter

AVL and Rohde & Schwarz automate EMC tests under real driving conditions

SEGGER Embedded Studio Version 7 includes source code of libraries

Microcontrollers learn to embrace neural networks

Kyocera develops GaN laser chip for mass production

SECORA Pay Bio to bring biometric payment cards to a new level

BluGlass partners with Ganvix to develop GaN VCSELs

Henkel and LAIIER to use printed electronics to drive smart building applications

Farnell signs a new global distribution partnership with Analog Devices

OpenLight PDK delivers unified electronic and photonic design platform