Engineering publications brought to you by Mark Allen

Laura Hopperton

Interconnection

Cliff extends USB data socket family

Consumer

Copper coating paves way for shatterproof smartphone screens

Power

ON launches CMOS modem IC for industrial communications

Engineering GCSE and A Level to be scrapped

Semi sales up 11% year-on-year

RF & Microwave

IDT has IQ modulator for next gen wireless communications

Research Design

Supercomputer passes Turing Test for the first time

Research Design

MIT has method for large scale graphene production

Power

Piezo sounder driver enables higher volume with lower currents

System Design

SiTime enters IoT market with smallest, lowest power TCZO

Research Design

Transistor breakthrough paves way for faster electronics

Embedded Software

PCB tool upgraded with a focus on design reuse