Engineering publications brought to you by Mark Allen

Louise Joselyn

RF & Microwave

Identifying new applications for rfid devices

Policy & Business

3d chip packaging set to enable increased integration

Policy & Business

Fault tolerant designs allow defective chips to be used instead of scrapped

EDA & Design Software

Chip designers move up to the next level of abstraction

Cover story: Smartening up the city with smart metering

EDA & Design Software

Starting out

Consumer

Leading companies look to develop South of France software industry

Consumer

Intel to expand in Sophia Antipolis?

EDA & Design Software

Coordinating collaboration: Board level technology

System Design

Full beam ahead

EDA & Design Software

Back to front

CPUs

Massively parallel, but massive challenges