Engineering publications brought to you by Mark Allen

Neil Tyler

Wireless Technology

L-com’s rubber duck antennas offer small size but a big reach

Wireless Technology

ST and Qualcomm announce strategic wireless/IoT collaboration

Electronics

Intel and US close to finalising $8.5bn in chips funding, or are they?

Embedded Systems

AMD releases energy-efficient EPYC Embedded 8004 series

Artificial Intelligence

BrainChip introduces low-power AI acceleration co-processor

Power

XP Power releases 150W/200W DC-DC converters offering ultra-wide 12:1 input range

Electronics

First IBM Quantum Data Centre opens in Europe

Communications Hardware

Infineon introduces 20 Gbps universal USB peripheral controller

Internet of Things

Advantech launches Edge Service Packages for IoT-enabled applications

Test & Measurement

Monolith and NIO Europe begin AI-driven anomaly detection for EV batteries

Skills & Careers

EngineeringUK announces launch of EUK Education

Electronics

First silicon-proven 3nm 24 Gbps UCIe subsystem validated