Engineering publications brought to you by Mark Allen

Neil Tyler

Electronics

sureCore and Universal Quantum announce tape-out of cryogenic IP demonstrator chip

Power

ST GaN driver integrates galvanic isolation for superior safety and reliability

Space

Teledyne e2v and Infineon partner on processor boot solution for edge computing space systems

Electronics

Europractice offering access to Pragmatic’s flexible integrated circuit foundry services through imec

Sensors

ST reveals latest FlightSense multi-zone distance sensor

Wireless Technology

NFC Forum unveils NFC’s Technology Roadmap through 2028

Electronics

Keysight acquires ESI Group

Board Level Design

Parker offers new gap filler pad with high thermal conductivity

Manufacturing

Report points to smart manufacturing boom

Power

600 V discrete IGBTs offer class-leading efficiency in power applications

Electronics

Renesas and Wolfspeed sign 10-year silicon carbide wafer supply agreement

Distribution

Mouser and Atmosic partner to accelerate growth of sustainable IoT devices