Engineering publications brought to you by Mark Allen

Neil Tyler

Automotive

Infineon and Stellantis agree MoU on multi-year delivery of SiC chips

Consumer

Second-hand device market to boom

Electronics

SiPearl and AMD collaborate to address exascale supercomputing

Electronics

NXP analogue front-end to enable software-defined factory

Distribution

RS signs £400m refinanced sustainability-linked loan

Automotive

HighTec extends support for Stellar SR6x automotive MCU family

Internet of Things

Solar harvesting technology IoT sensors

Automotive

AI-powered cloud-connected EV battery management system

Internet of Things

Codasip boosts RISC-V security with acquisition of Cerberus

Communications

AMD makes 4th Gen EPYC processors available

Distribution

Arrow Electronics unveils JetCarrier96 carrier board

Electronics

Arasan announces MIPI DSI IP for FPGA