Engineering publications brought to you by Mark Allen

Neil Tyler

Interconnection

Hirose expands hybrid FPC-to-board connector offering

Automotive

Magnachip unveils third-generation 200V MV MOSFETs

Displays

High-performance, small-size TFT display modules

Electronics

SK Hynix to invest $11bn in new memory chip plant

Electronics

Scintil Photonics secures investment boost

Consumer

Meta and Qualcomm sign VR chip deal

Power

IONETIC reveals revolutionary electric vehicle battery pack technology

ASIC & SoC

Making chip design easy

ASIC & SoC

Arasan achieves ISO 26262 ASIL B for its Total eMMC IP solution

Power

300W medical PSU family suitable for home applications

Automotive

Versinetic to launch EV charging software development kit at CENEX LCV 2022

Materials

Membrane separators recover lithium from used lithium-ion batteries