Engineering publications brought to you by Mark Allen

ASIC & SoC

MediaTek’s Dimensity 9400+ offers on-device Gen-AI and agentic AI capabilities

Avnet ASIC selected as channel partner by Hailo for TSMC silicon production

GUC tapes-out world's first HBM4 IP on TSMC N3P

Deploying anti-tamper IP

PAN1783 Bluetooth 5.3 LE module now features isochronous channels and LE audio

Renesas introduces Bluetooth Low Energy SoC for automotive applications

Brite Semiconductor releases DDR3/4, LPDDR3/4 Combo IP

Microchip’s PolarFire SoC FPGAs achieve AEC-Q100 qualification

TSMC and MediaTek demonstrate integrated PMU and PA

Global ‘Top 10’ IC design houses see strong growth in 2024

Nordic's nRF54L15DK Development Kit being stocked by Mouser

Morse Micro launches the MM8102 Wi-Fi HaLow chip