Engineering publications brought to you by Mark Allen

Neil Tyler

Wireless Technology

Infineon introduces AIROC CYW20829 Bluetooth LE system on chip

Apple valuation tops $3trn

Passive Components

Thick film current sense resistors target sensing applications

CPUs

ASPEED and CEVA collaborate to improve voice on Cupola360 SoCs

Displays

Silicon Photonics platform with monolithically integrated III-V lasers

ASIC & SoC

First silicon demonstration wafers with integrated embedded ReRAM module

CPUs

EIC Accelerator programme awards funding to SiPearl

Board Level Design

First Open Wi-Fi 'HaLow' development platform

Manufacturing

24-position optical encoder switch

Supermicro records world first TPCx-HCI benchmark result

Wireless Technology

Delivering on climate goals

Board Level Design

Arrow Electronics introduces flexible data acquisition platform