Engineering publications brought to you by Mark Allen

Communications Hardware

Plessey unveils 2.5-micron pixel pitch ultra-high resolution microLED display

Oxbotica unveils the software complexity associated with autonomous vehicle testing

Plans to build high-definition micro-LED matrix solution for adaptive driving beams

Telensa joins Qualcomm Smart Cities Accelerator Program

Trusted distributed computing

Arrow Electronics introduces XoverIoT certified Sigfox modules

Distortion-cancelling high-voltage LED driver

Qualcomm and Ericsson prepare next phase of 5G commercialisation

Imec and NUS to collaborate on chip-based quantum cryptography technology

CEA-Leti and Orolia unveil FlexFusion, a new navigation technology

GSMA and 5GAA sign cooperation agreement

AI upgrades the digital twin