Engineering publications brought to you by Mark Allen

CPUs

Security IP for Die-to-Die communication between chiplets

NSITEXE and Green Hills Software partner on RISC-V solutions

World's first live demos of Wi-Fi 7 technology

Annual semiconductor revenues exceed $500 billion for the first time

TI Hi-Z buffer amplifier increases signal bandwidth tenfold

Infineon extends support for SEMPER NOR Flash memories

BrainChip announces commercialisation of AKD1000 AIoT chip

Deep Vision licenses SiFive Intelligence X280 processor

Light leverages Cadence Tensilica Vision Q7 DSP for advanced ADAS systems

Toshiba launches high performance Ethernet PCIe bridge IC

VSORA's Tyr chip family targets autonomous driving

CEVA unveils Bluetooth Dual Mode 5.3 SIG qualified platform