Engineering publications brought to you by Mark Allen

Manufacturing

MIPI Alliance releases the MIPI I3C sensor interface specification

Compact telecoms light amplifier demonstrates higher gain

Modular compute platform to ‘transform’ future devices

Wireless sensor module for range of apps

‘Lanes’ mean more power, faster charging, says UCLA team

Free electronics design tools and PCB design software reviewed

Bosch demonstrates Ultrahaptics’ technology in concept car

Anritsu launches BER test solution for 100G-EPON

Two VME SBCs to implement latest processor

Nano-chimneys in graphene material may cool circuits

Versatile features added to 1U MicroTCA chassis

Process to print flexible e-stickers