Engineering publications brought to you by Mark Allen

Electronics

Prismatic Supercapacitors - Maximum performance in minimal space!

CSignum secures £6m to transform underwater wireless networks

Samsung set to end DDR4 production in the face of Chinese competition

Wayve opens Testing and Development Centre in Japan

VeriSilicon launches ultra-low power OpenGL ES GPU for wearables

Renesas debuts new additions to its RA0 microcontroller portfolio

Back flip FPC connector features staggered contact array for narrow-pitch

TSMC remains bullish despite tariff headwinds

Cadence to acquire Arm Artisan Foundation IP business

Navitas’ SiCPAK power modules deliver reliability at high temperatures

SemiQ 1200 V SiC MOSFET modules enable more compact, cost-optimised systems

JEDEC announces release of the JESD270-4 HBM4 standard