Engineering publications brought to you by Mark Allen

Memory

Winbond unveils industry-first x64 LPDDR3 memory chip

CryptoAuthentication token enhances embedded cybersecurity

Winbond provides end-to-end security for IoT devices

Next-generation memory targets AI and 5G applications

Samsung unveils Gen 3 high-bandwidth flash

Hardened single-chip synchronous buck and LDO for space applications

AAEON single board computer UPS-P4-A10-08128

Everspin and Xilinx team up to address needs of storage industry

UK team takes the next step towards III-V Memory

Project looks to advance DNA-based archival data storage

Mouser signs global supply chain agreement with GigaDevice

KIOXIA develops 3D semi-circular flash memory cell structure