Engineering publications brought to you by Mark Allen

Semiconductors

Reference design for 3D spatial audio in headsets and TWS earbuds

Renesas introduces high-performance entry-line MCUs

ST unveils STM32 ecosystem extensions

Xilinx and NEC look to accelerate roll-out of next-generation 5G radio units

Renesas extends emWin license to include all RA MCUs

MicroAi brings AI training to Renesas RA MCU product line

Neural decision processor for vision edge AI applications

Changing the paradigm

Flex Power Modules joins Xilinx Partner Program

Deep Vision raises $35m in Series B Funding

Synopsys unveils ARC DSP IP solutions for embedded SoCs

ST unveils 70W high-power chipsets