Engineering publications brought to you by Mark Allen

ASIC & SoC

MediaTek develops first chip using TSMC's 3nm process

Codasip and Siemens to deliver trace solution for custom processors

Agile Analog joins TSMC Open Innovation Platform IP Alliance Program

GOWIN and Andes Technology unveil RISC-V CPU and subsystem embedded 22nm SoC FPGA

Winbond and Mobiveil collaborate on ultra-low power applications

QuickLogic unveils customisable eFPGA IP on GlobalFoundries' 12LP process

Delivering 'open core surgery'

Nordic to acquire AI/ML technology in the US

Amazon Sidewalk SoCs & Developer Tools help to accelerate adoption

Dream Chip Technologies tapes out a 10-TOPS SoC in 22nm

Global semiconductor industry on track for 2024 recovery

Partnership to deliver highly integrated terrestrial and satellite IoT communications solutions