Engineering publications brought to you by Mark Allen

Semiconductors

Efinix announces Trion Titanium tapeout at 16nm

Cryptographic companion device brings security to the automotive market

Dialog Semiconductor launches advanced analogue GreenPAK IC

Apple launches MacBook laptops using first in-house designed microprocessor

MediaTek targets mass market 5G smartphones with Dimensity 700

Teledyne unveils first direct microwave synthesis DAC

NXP looks to tackle complexity of automotive software development

NXP unveils low-cost, low-power, MCU-based face recognition solution

Record speeds on facial detection test using an FPGA cluster

TI licences Imagination's B-Series GPU for its Jacinto automotive family

ST unveils high-voltage gate driver with 6kV galvanic isolation

HES-DVM simulation acceleration flow for Microchip FPGA designs