Engineering publications brought to you by Mark Allen

Semiconductors

Compact 4-channel automotive power management IC for vehicle camera modules

Cog Systems’ Secure Virtualization now available in Snapdragon platforms

Triaxis Hall position sensors now with dual-output option

Industry’s first verification IP for USB4 announced by Cadence

Expanded dual- and single-core dsPIC DSC family from Microchip

STMicroelectronics launches water-resistant MEMS pressure sensor

Combining low power with intelligence

RX functional safety solution

Intel unveils first 58Gbps FPGA transceiver enabling 400G Ethernet deployment

Implementing true wireless audio

Analog Devices launches integrated microwave upconverter and downconverter

Cadence Tensilica ConnX B20 DSP boosts performance