Engineering publications brought to you by Mark Allen

Electronics

Halo Microelectronics introduces 3A I2C controlled single-cell battery charger

GOWIN and Andes Technology unveil RISC-V CPU and subsystem embedded 22nm SoC FPGA

BorgWarner to integrate ST’s SiC technology into Viper power modules

DVCon Europe announces keynotes for 10th anniversary conference

Farnell research shows engineers trust AI to select components - up to a point

Toshiba releases 3rd generation SiC MOSFETs with reduced switching losses

Ambient Photonics and e-peas to develop power solutions for connected devices

TRIAD streamlines edge processing of data in phased-array antennas

Winbond and Mobiveil collaborate on ultra-low power applications

Voxel AI increases funding to $30m with latest strategic funding round

Cadence and Arm to accelerate data centre design using Neoverse V2 platform

QuickLogic unveils customisable eFPGA IP on GlobalFoundries' 12LP process