Engineering publications brought to you by Mark Allen

Automotive

WEEE Directive 2012/19/EU updated and expanded

Multi-GNSS receiver with embedded security

MRAM solutions for automotive systems

Automotive grade MLCCs with high operating temperatures

Sundance EMC2-Z7030 SBC integrates Xilinx SDSoC development environment

Schneider Electric selects Everspin's MRAM for its Modicon M580 ePAC

Industry’s most powerful universal SoC debug environment

Synergy Platform expanded with MCUs and updated software package

SoCs for 3D instrument clusters

CPI installs roll to roll digital lithography line to develop OTFTs

Microchip launches online 8bit MCU development environment

Growing European support network for Renesas Synergy Platform