Engineering publications brought to you by Mark Allen

Automotive

High-performance gyroscope for automotive, aeronautic and industrial applications

Veoneer signs collaboration deal with Qualcomm

Foxconn and Winbond announce strategic investment in Kneron

Ansys' HFSS Mesh Fusion enables the design of entire systems

Complete EV charge point solution

Faster 125°C operation compatible EEPROMs extend service life

CPI joins consortium to develop quantum sensors for end-of-line battery testing

NXP releases Wi-Fi 6E Tri-Band chipset for access devices

Cepton introduces lidar sensor for near-range applications

Hailo licenses NoC IP to accelerate dataflow performance

Guerrilla RF targets cellular market with latest power amplifiers

Xpeng Motors selects u-blox GNSS technology for EV sedan