With electronic products more sophisticated than ever, with higher density, lower voltage margins and more advanced processes, engineers are having to increase functionality and maintain or even decrease power consumption within a smaller form factor.
As these designs become more challenging, engineers have to be able to solve complex interactions between components and across systems, critical for designing cutting-edge artificial intelligence machine learning, autonomous vehicle, 5G communications, high-performance computing and Industrial Internet of Things applications.
HFSS Mesh Fusion, available in Ansys HFSS 2021 R1, has been developed to help engineers combine integrated circuits (IC), packaging, connectors, printed circuit boards, antennas and platform in a single Ansys HFSS analysis to predict EM interactions.
HFSS Mesh Fusion bypasses previous barriers by applying optimal meshing technology at the component level, parallelised across cores, clusters or within Ansys Cloud. A breakthrough solver technology then extracts a fully coupled, uncompromised, full-wave EM matrix. By enabling much more complex designs to be solved, companies can confidently push the limits of performance to create state-of-the-art products.
“HFSS Mesh Fusion helps IC designers effectively manage the capacity, complexity, dimensional range and density of geometric detail in a fully coupled EM simulation,” said John Lee, vice president and general manager at Ansys.
“This empowers engineers to break the old rules, innovate leading-edge designs at higher frequencies and within tighter form factors, tape out with confidence and deliver trail-blazing products with more functionality than ever thought possible. This supports numerous highly sophisticated applications, including 5G communications, autonomous driving and many more.”
