Engineering publications brought to you by Mark Allen

Electronics

Renesas targets high-performance robotics applications with latest MPU

NeoCortec signs new global distribution agreement with DigiKey

Cadence expands Tensilica vision family with radar accelerator and automotive DSPs

Farnell introduces Abracon’s EDLC radial supercapacitors

Delivering for patients

EU Consortium developing next-gen Edge-AI technologies

Micron announces breakthrough in UFS packaging

Keysight unveils first integrated EDA workflow for Qubit design

All-in-One cellular IoT platform initiative

Overproduction in the mobile phone industry

Samsung launches 36GB HBM3E 12H DRAM, boosting capacity by 50%

First cryogenic electronic circuits to control diamond spin qubits